PPD Deposition of thin films is achieved by ablation of a rotating target material by a nanosecond pulse of plasma. The material is deposited on the surface of a suitable heated (up to 1000C°) substrate.
The system is simple and rugged in construction and it is very convenient in terms of installation and running costs (comparison with Pulsed Laser Deposition (PLD) )
It is particularly energy friendly in terms of power consumption.
The potentiality of the system is the scalability to:
- a multitarget configuration for the fabrication of hetero-multilayers
- of a multiple source systems for large area applications.
The main characteristics of a PPD deposition system are:
A very wide dynamic range of deposition rates: 0.005 - 10 nm/s
A wide range of operation vacuum conditions: 10 -2, 10 -5 mbar
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